1. Lithography materials
Photoresists
Positive PR (AZ1512, 1518, 1502), Negative PR (N1400), SU-8 PR, Thick PR
- Positive photoresist
Developer
AZ300-MIF, TMAH, MF-319
- Developer (TMAH 2.38%)
Adhesion promoters
Photoresist adhesion promoter
- HMDS
Strippers
Photoresist removal
- SVC series
- PGMEA
Anti-reflective coatings
Anti-reflective layers for lithography
- DUV ARC
- BARC
2. CMP materials
CMP slurries
Oxide, Copper, Tungsten CMP slurries
- CMP slurry (silica)
CMP pads
Hard / soft polishing pads
- Hard polishing pad
- Soft polishing pad
CMP accessories
CMP accessories
- Conditioner disc
- CMP filters
3. Thin film materials
Sputtering Targets
PVD targets for thin-film deposition – metals, oxides, alloys
- Ti target Ø2" 99.99%
- Ti target Ø3" 99.99%
- Cu target Ø2" 99.99%
- Cu target Ø3" 99.99%
- Al target Ø2" 99.999%
- Au target Ø2" 99.99%
- Ag target Ø2" 99.99%
- Cr target Ø2" 99.95%
- Mo target Ø2" 99.95%
- ITO target Ø3" 99.99%
- ZnO target Ø2" 99.99%
Evaporation materials
Thermal / e-beam evaporation
- Metal pellets
- Metal wire
4. Wet process materials
Cleaning chemicals
Semiconductor-grade solvents
- Acetone (semiconductor grade)
Wet etchants
Wet etchants
- Buffered oxide etch (BOE)