1. Temporary bonding solutions
Temporary bonding adhesive
Temporary wafer-to-carrier adhesive
- Highly adhesive bonding glue
Debonding chemicals
Debond and residue removal
- Debond solvent
- Residue cleaner
- Thermal-slide
- Laser debond
- UV debond
2. Carrier solutions
Silicon / Glass carrier wafer
- Si carrier
- Glass carrier
Temporary carrier wafer
- 4" – 12"
3. Dicing consumables
UV dicing / back grinding tape
- UV dicing tape
- Back grinding tape
Dicing blade
- Hub blade
- Hubless blade
4. Plating & metallization
Cu, Ni, Au plating chemistry
Plating for bumps, RDL, TSV
- Cu
- Ni
- Au
5. Assembly materials
Underfill
- Capillary underfill
Silver epoxy
- Silver epoxy
Die attach film
- DAF
Conductive adhesive
- ICA
- ACA / ACF
6. Encapsulation materials
Mold compound
- Epoxy mold compound